Intel EU80570PJ0676MN Ficha de datos descargar pdf (Pagina 73)

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LGA775 Socket Heatsink Loading

Thermal and Mechanical Design Guidelines 73

Figure 7-6. Board Deflection Definition

d’1

d’2

A.3.2 Board Deflection Limits

Deflection limits for the ATX/µATX form factor are:

d_BOL – d_ref≥ 0.09 mm and d_EOL – d_ref ≥ 0.15 mm

And

d’_BOL – d’_ref≥ 0.09 mm and d_EOL’ – d_ref’ ≥ 0.15 mm

NOTES:

1. The heatsink preload must remain within the static load limits defined in the processor

datasheet at all times.

2. Board deflection should not exceed motherboard manufacturer specifications.

1 2 ... 68 69 70 71 72 73 74 75 76 77 78 ... 127 128

Contents 3
Figures 6
Revision History 9
1 Introduction 11
1.1.3 Document Scope 12
1.2 References 13
1.3 Definition of Terms 13
Ψ measurements 14
Information 15
2.1.2 Heatsink Attach 17
2.2 Thermal Requirements 18
2.2.2 Thermal Profile 19
2.2.4 T 20
2.3.1 Heatsink Size 22
2.3.2 Heatsink Mass 22
2.3.3 Package IHS Flatness 23
2.4.3 Summary 25
3 Thermal Metrology 27
3.1.1 Example 28
Assessment 29
Guidelines 29
Thermal Metrology 30
Thermal Monitor Feature 33
4.2.1 PROCHOT# Signal 34
4.2.3 Thermal Monitor 2 35
4.2.5 On-Demand Mode 37
4.2.6 System Considerations 37
Considerations 38
4.2.8 THERMTRIP# Signal 38
(BTX) Thermal/Mechanical 41
Design Information 41
5.1.2 Acoustics 42
5.1.3 Effective Fan Curve 43
Airflow (cfm) 44
5.1.5 Altitude 45
5.2.2 Power Cycling 47
5.4 Safety Requirements 49
Thermal Module Assembly 49
Less curvature in region 50
Shock Load 50
6 ATX Thermal/Mechanical 53
6.2.1 Heatsink Performance 55
6.2.2 Acoustics 56
6.2.3 Altitude 56
PSD (g^2/Hz) 58
6.3.2 Power Cycling 59
6.5 Safety Requirements 61
Thermal Mechanical Design 61
Less curvature in 62
Core shoulder 63
Φ36.14 +/- 0.10 mm 64
Φ38.68 +/- 0.30 mm 64
7 Intel 65
Quiet System 65
Technology (Intel 65
(Output Weighting Matrix) 66
RPM Temperature 67
Intel® (G)MCH 68
7.3 Intel 70
Loading 71
Metrology 77
Heatsink Clip Load Metrology 78
Load Cells (3x) 79
Preload Fixture (copper 79
B.3 Test Procedure Examples 80
Measurement 81
Appendix C Thermal Interface 83
Management 83
Thermal Interface Management 84
Appendix D Case Temperature 85
Reference Metrology 85
D.4 IHS Groove 87
TC Wire with Insulation 94
IHS with Groove 94
D.5.3 Solder Process 97
Installation 100
Extended (BTX) System 105
Thermal Considerations 105
TMA Airflow 107
Reference Design 109
BOARD PRIMARY SIDE 112
BOARD SECONDARY SIDE 113
Mechanical Drawings 114
Figure 7-54. Intel 126
Appendix H Intel 127
Enabled Reference 127
Solution Information 127

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