Intel EU80570PJ0676MN Ficha de datos Pagina 97
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Case Temperature Reference Metrology
Thermal and Mechanical Design Guidelines 97
16. Place the two pieces of solder in parallel, directly over the thermocouple bead
(Figure 7-26).
Figure 7-26. Positioning Solder on IHS
17. Measure the resistance from the thermocouple end wires again using the DMM
(refer to Section D.5.1.step 2) to ensure the bead is still properly contacting the
IHS.
D.5.3 Solder Process
18. Make sure the thermocouple that monitors the Solder Block temperature is
positioned on the Heater block. Connect the thermocouple to a handheld meter to
monitor the heater block temperature
19. Verify the temperature of the Heater block station has reached 155° C ±5° C
before you proceed.
20. Connect the thermocouple for the device being soldered to a second hand held
meter to monitor IHS temperature during the solder process.
- Contents 3
- Figures 6
- Revision History 9
- 1 Introduction 11
- 1.1.3 Document Scope 12
- 1.2 References 13
- 1.3 Definition of Terms 13
- Ψ measurements 14
- Information 15
- 2.1.2 Heatsink Attach 17
- 2.2 Thermal Requirements 18
- 2.2.2 Thermal Profile 19
- 2.2.4 T 20
- 2.3.1 Heatsink Size 22
- 2.3.2 Heatsink Mass 22
- 2.3.3 Package IHS Flatness 23
- 2.4.3 Summary 25
- 3 Thermal Metrology 27
- 3.1.1 Example 28
- Assessment 29
- Guidelines 29
- Thermal Metrology 30
- Thermal Monitor Feature 33
- 4.2.1 PROCHOT# Signal 34
- 4.2.3 Thermal Monitor 2 35
- 4.2.5 On-Demand Mode 37
- 4.2.6 System Considerations 37
- Considerations 38
- 4.2.8 THERMTRIP# Signal 38
- (BTX) Thermal/Mechanical 41
- Design Information 41
- 5.1.2 Acoustics 42
- 5.1.3 Effective Fan Curve 43
- Airflow (cfm) 44
- 5.1.5 Altitude 45
- 5.2.2 Power Cycling 47
- 5.4 Safety Requirements 49
- Thermal Module Assembly 49
- Less curvature in region 50
- Shock Load 50
- 6 ATX Thermal/Mechanical 53
- 6.2.1 Heatsink Performance 55
- 6.2.2 Acoustics 56
- 6.2.3 Altitude 56
- PSD (g^2/Hz) 58
- 6.3.2 Power Cycling 59
- 6.5 Safety Requirements 61
- Thermal Mechanical Design 61
- Less curvature in 62
- Core shoulder 63
- Φ36.14 +/- 0.10 mm 64
- Φ38.68 +/- 0.30 mm 64
- 7 Intel 65
- Quiet System 65
- Technology (Intel 65
- (Output Weighting Matrix) 66
- RPM Temperature 67
- Intel® (G)MCH 68
- 7.3 Intel 70
- Loading 71
- Metrology 77
- Heatsink Clip Load Metrology 78
- Load Cells (3x) 79
- Preload Fixture (copper 79
- B.3 Test Procedure Examples 80
- Measurement 81
- Appendix C Thermal Interface 83
- Management 83
- Thermal Interface Management 84
- Appendix D Case Temperature 85
- Reference Metrology 85
- D.4 IHS Groove 87
- TC Wire with Insulation 94
- IHS with Groove 94
- D.5.3 Solder Process 97
- Installation 100
- Extended (BTX) System 105
- Thermal Considerations 105
- TMA Airflow 107
- Reference Design 109
- BOARD PRIMARY SIDE 112
- BOARD SECONDARY SIDE 113
- Mechanical Drawings 114
- Figure 7-54. Intel 126
- Appendix H Intel 127
- Enabled Reference 127
- Solution Information 127
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